Thermally Conductive Ceramic Fillers
Wide variety of Aluminum Oxide and Hexagonal Boron Nitride when thermal management is key!
Aluminum Oxide (Al2O3) filler has been manufactured at Showa Denko K.K. for over 80 years and strides continue to be made in this market. Commonly referred to as alumina, Showa Denko K.K. supplies a wide variety of grades with unique and distinguishing features.
- Roundish Alumina (AS Series): Manufactured in Yokohama, Japan, the AS Series of roundish alumina is a single grain corundum with fewer crystal edges. Roundish Alumina is great for high filling into resins for thermal conductivity and low viscosity due to its large particle diameter and particle size distribution.
- Spherical Alumina (CB Series): A single grained corundum that has an almost perfect spherical particle shape. Spherical Alumina lends itself extremely well for applications that require optimal fluidity such as potting compounds and greases.
Hexagonal Boron Nitride (hBN) can provide optimal thermal conductivity and is offered as both platelet and agglomerate types. By utilizing Showa Denko's proprietary technology, our agglomerate grade of hBN is particularly unique by providing exceptionally high particle hardness while maintaining a low level of impurities.